Capability
|
Year
|
2012
|
2013
|
2014
|
|
|
Average Layer
|
6
|
8
|
8
|
|
|
Highest Layer
|
20
|
20
|
20
|
|
|
Max.
Board Size
|
620×450mm
|
620×450mm
|
640×500mm
|
|
|
Min.
Board Size
|
50×30mm
|
30×30mm
|
30×30mm
|
|
|
Max
final board thickness
|
5.0mm
|
5.0mm
|
5.2mm
|
|
|
Min
final board thickness
|
0.3mm
|
0.2mm
|
0.2mm
|
|
|
Min.
Inner Layer Board Thickness
|
0.1mm
|
0.075mm
|
0.075mm
|
|
|
Min. hole to copper
|
6mil
|
6mil
|
6mil
|
|
|
Min.
annular ring
|
3.6mil
|
3.4mil
|
3.2mil
|
|
|
Via
hole without annular ring
|
No
|
Yes
|
yes
|
|
|
Max
Finished Copper
|
Outer
|
6OZ
|
6OZ
|
7OZ
|
|
Inner
|
5OZ
|
6OZ
|
7OZ
|
|
|
Min.
drill diameter
|
0.15mm
|
0.10mm
|
0.10mm
|
|
|
Board
thickness/drill diameter
|
12:01
|
14:01
|
14:01
|
|
|
Min.
line/space
|
3.5/3.5mil
|
3/3mil
|
3/3mil
|
|
|
HDI
|
1+N+1
|
2+N+2
|
3+N+3
|
|
|
Other
process
|
Carbon
oil , Peelable mask
|
Ceramic Board
|
……
|
|
|
sink
hole ; blind rout
|
Aluminum Board,
|
|||
|
Surface Treatment
|
ENIG
;HAL ; Lead Free HAL; Chemical Tin ; OSP Immersion Silver ; Plated
gold
|
……
|
……
|
|